Development tools handbook

Development tools handbook

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Ceramic dual in-line package Intel type C. Ceramic flatpack package Intel type F; Ceramic leadness chip carrier Intel type R; Ceramic pin grid array package Intel type A; Ceramic pin grid array module; Ceramic quadpack package Intel type Q; Cerdip dual in-line package Intel type D; Cerquad package; Plastic dual in-line package Intel type P; Plastic fine pitch chip carrier; Plastic leaded chip carrier package Intel type N; Plastic flatpack package Intel type P.ENVIRONMENTAL CHARACTERISTICS Operating Temperature: 10*Cto30AdC Relative Humidity. ... System confidence tests iPDS System Literature Kit including: a€c Intel Personal Development System Usera#39;s Guide 162606 a€c Intel Personal Development ... Programming Manual 9800301 a€c 8080/8085 Assembly Language Reference Card 9800438 a€c MSC-8085 Utilities Usera#39;s Guide for 8080/ 8085 Basedanbsp;...

Title:Development tools handbook
Author: Intel Corporation
Publisher:Intel Corporation (CA) - 1987-02

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