RF and Microwave Microelectronics Packaging

RF and Microwave Microelectronics Packaging

4.11 - 1251 ratings - Source

RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.System-on-package (SoP) integration using multilayer low-temperature co-fired ceramic (LTCC) technology enables ... I¼m P-HEMT) process which features a typical drain source break down voltage of 5.5 V. This circuit diagram is shown in anbsp;...

Title:RF and Microwave Microelectronics Packaging
Author: Ken Kuang, Franklin Kim, Sean S. Cahill
Publisher:Springer Science & Business Media - 2009-12-01

You must register with us as either a Registered User before you can Download this Book. You'll be greeted by a simple sign-up page.

Once you have finished the sign-up process, you will be redirected to your download Book page.

How it works:
  • 1. Register a free 1 month Trial Account.
  • 2. Download as many books as you like (Personal use)
  • 3. Cancel the membership at any time if not satisfied.

Click button below to register and download Ebook
Privacy Policy | Contact | DMCA