Simiconductor Wafer Bonding 9

Simiconductor Wafer Bonding 9

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This issue of ECS Transactions covers state-of-the-art RaD results of the last 1.5 years in the field of semiconductor wafer bonding technology. Wafer Bonding Technology can be used to create novel composite materials systems and devices what would otherwise be unattainable. Wafer bonding today is rapidly expanding applications in such diverse fields as photonics, sensors, MEMS, X-ray optics, non-electronic microstructures, high performance CMOS platforms for high end servers, Si-Ge, strained SOI, Germanium-on-Insulator (GeOI), and Nanotechnologies.... the wafers are also cleaned with DI water and megasonic power in the bonding tool like the CL200 from SUSS. ... Manual tools for in-situ alignment and anodic bonding exist on the market, the reliability for high volume production andanbsp;...

Title:Simiconductor Wafer Bonding 9
Author: Helmut Baumgart
Publisher:The Electrochemical Society - 2006-01-01

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